| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| NM1482KS2AXC2 |
|
NANYA南亚 | BGA | 16+ | 390 | 2025-07-12 | ||
| JY990 |
|
MICRON/美光 | BGA | 18 | 31 | 2025-07-12 | ||
| FM6BD2G1GA |
|
ESMT/晶豪科技 | BGA | 16+ | 650 | 2025-07-12 | ||
| W71NW20GF3W |
|
WINBOND/华邦 | BGA | 16+ | 590 | 2025-07-12 | ||
| 2400225_001 1702 |
|
TI/德州仪器 | BGA | 119 | 2025-07-12 | |||
| JSFBAB3VHABBG |
|
EMMC | BGA | 18 | 215 | 2025-07-12 | ||
| FMN2ET2TCJ_1H |
|
FIDELIX | BGA | 18+ | 68 | 2025-07-12 | ||
| FM6BD4G2GXA |
|
SAMSUNG/三星 | BGA | 62 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MDM9607 |
|
QUALCOMM/高通 | BGA | 18+ | 15000 | 2025-07-12 | ||
| K4T1G084QF |
|
SAMSUNG/三星 | BGA | 17 | 124 | 2025-07-12 | ||
| MDM9625 |
|
QUALCOMM/高通 | BGA | 17 | 58 | 2025-07-12 | ||
| APQ8064 | QUALCOMM/高通 | BGA | 14 | 3000 | 2025-07-12 | |||
| MSM8227 | QUALCOMM/高通 | BGA | 14 | 2000 | 2025-07-12 | |||
| PM8921 | QUALCOMM/高通 | BGA | 13 | 5000 | 2025-07-12 | |||
| MSM8939 | QUALCOMM/高通 | BGA | 14 | 2000 | 2025-07-12 | |||
| MSM8936 | QUALCOMM/高通 | BGA | 14 | 1000 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| JY990 |
|
MICRON/美光 | BGA | 18 | 31 | 2025-07-12 | ||
| K3MF8F80DM-MGCE | SAMSUNG/三星 | BGA | 35 | 2025-07-12 | ||||
| K4E8E304ED-AGCE | SAMSUNG/三星 | BGA | 15 | 45 | 2025-07-12 | |||
| K4P8G304EB-AGC2 | SAMSUNG/三星 | BGA | 15+ | 46 | 2025-07-12 | |||
| K3PE7E700D-XGC1 | SAMSUNG/三星 | BGA | 15+ | 130 | 2025-07-12 | |||
| KLMBG4GEAC-B001 |
|
SAMSUNG/三星 | BGA | 280 | 2025-07-12 | |||
| K3QF7F70DM-QGCF |
|
SAMSUNG/三星 | BGA | 16 | 60 | 2025-07-12 | ||
| TJA1040T | NXP/恩智浦 | SOP8 | 19+ | 3000 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MX30LF1G08AA |
|
MXIC/旺宏 | BGA | 16+ | 980 | 2025-07-12 | ||
| CC2540 | TI/德州仪器 | QFN | 50 | 2025-07-12 | ||||
| CC2541 | TI/德州仪器 | QFN | 600 | 2025-07-12 | ||||
| C8051F340 | SILCON/芯科 | 127 | 2025-07-12 | |||||
| 71M6542F_IGT | TERIDIAN | 2000 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| KLMAG2WEMB-B031 | SAMSUNG/三星 | BGA | 37 | 2025-07-12 | ||||
| KLMCG8GEAC-B031 | SAMSUNG/三星 | BGA | 856 | 2025-07-12 | ||||
| K3RG2G20AM-MGCH |
|
SAMSUNG/三星 | BGA | 15 | 289 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| SN3106BI212E | SI-EN/矽恩 | QFN | 1644 | 10000 | 2025-07-12 | |||
| SKY77824-11 | SKYWORKS/思佳讯 | 500 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| FT232RQ | FTDI/飞特帝亚 | QFN-32 | 2000 | 2025-07-12 | ||||
| TLC2274AMDRG4 | TI/德州仪器 | SOP14 | 8127+ | 2500 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RG82855GME | INTERNATIONAL COMPONENTS CORP | BGA | 75 | 2025-07-12 | ||||
| MMIC362510T4087 | TDK/东电化 | 6000 | 23+ | 60000 | 2025-07-12 | |||
| SB450 | ATI | 95 | 2025-07-12 | |||||
| 74LVC1G66GM,115 | NEXPERIA/安世 | 23+ | 25087 | 2025-07-12 | ||||
| AM82801UX | INTEL/英特尔 | BGA | 12 | 2025-07-12 | ||||
| NH82801HEM | INTEL/英特尔 | BGA | 50 | 2025-07-12 | ||||
| AC82GS45-SLB92 | INTEL/英特尔 | BGA | 316 | 2025-07-12 | ||||
| AC82PM45-SLB97 | INTEL/英特尔 | BGA | 179 | 2025-07-12 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RG82855GME | INTERNATIONAL COMPONENTS CORP | BGA | 75 | 2025-07-12 |
