| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TPS27081ADDCR | T | SOT23 | 22+ | 10000 | 2025-09-01 | |||
| M430F413REVC | T | QFP64 | 2000 | 2025-09-01 | ||||
| T950X_S | T | 404 | 2025-09-01 | |||||
| NT71101YBG_103 | N | 152 | 2025-09-01 | |||||
| N51822QFAC | 9 | 140 | 2025-09-01 | |||||
| WTR2605-0VV | QUALCOMM/高通 | BGA | 17 | 1000 | 2025-09-01 | |||
| MSM8274-1AC | QUALCOMM/高通 | BGA | 17 | 200 | 2025-09-01 | |||
| VC7824-31 | VANCHIP/唯捷创芯 | 16+ | 2000 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| TB6575FNG | TITAN OPTO | SSOP-24 | 21+ | 4000 | 2025-09-01 | |||
| AR9271-1L1E | QUALCOMM/高通 | 500 | 2025-09-01 | |||||
| G7020 | U-BLOX | QFN40 | 500 | 2025-09-01 | ||||
| MSM8936 | QUALCOMM/高通 | BGA | 14 | 1000 | 2025-09-01 | |||
| MSM8939 | QUALCOMM/高通 | BGA | 14 | 2000 | 2025-09-01 | |||
| PM8921 | QUALCOMM/高通 | BGA | 13 | 5000 | 2025-09-01 | |||
| MSM8227 | QUALCOMM/高通 | BGA | 14 | 2000 | 2025-09-01 | |||
| APQ8064 | QUALCOMM/高通 | BGA | 14 | 3000 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT6323GA | MTK/联发科 | 263 | 2025-09-01 | |||||
| TJA1040T | NXP/恩智浦 | SOP8 | 19+ | 3000 | 2025-09-01 | |||
| K3QF7F70DM-QGCF |
|
SAMSUNG/三星 | BGA | 16 | 60 | 2025-09-01 | ||
| KLMBG4GEAC-B001 |
|
SAMSUNG/三星 | BGA | 280 | 2025-09-01 | |||
| K3PE7E700D-XGC1 | SAMSUNG/三星 | BGA | 15+ | 130 | 2025-09-01 | |||
| K4P8G304EB-AGC2 | SAMSUNG/三星 | BGA | 15+ | 46 | 2025-09-01 | |||
| K4E8E304ED-AGCE | SAMSUNG/三星 | BGA | 15 | 45 | 2025-09-01 | |||
| H9CKNNNDATMT | SKHYNIX/海力士 | BGA | 166 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| 71M6542F_IGT | TERIDIAN | 2000 | 2025-09-01 | |||||
| C8051F340 | SILCON/芯科 | 127 | 2025-09-01 | |||||
| CC2541 | TI/德州仪器 | QFN | 600 | 2025-09-01 | ||||
| CC2540 | TI/德州仪器 | QFN | 50 | 2025-09-01 | ||||
| MX30LF1G08AA |
|
MXIC/旺宏 | BGA | 16+ | 980 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K3RG2G20AM-MGCH |
|
SAMSUNG/三星 | BGA | 15 | 289 | 2025-09-01 | ||
| THGAF8T0T43BAIR | TOSHIBA/东芝 | BGA | 719 | 2025-09-01 | ||||
| KLMCG8GEAC-B031 | SAMSUNG/三星 | BGA | 856 | 2025-09-01 | ||||
| KLMAG2WEMB-B031 | SAMSUNG/三星 | BGA | 37 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| STM32F427ZGT6 | ST/意法 | LQFP144 | 21+ | 5750 | 2025-09-01 | |||
| SKY77824-11 | SKYWORKS/思佳讯 | 500 | 2025-09-01 | |||||
| SN3106BI212E | SI-EN/矽恩 | QFN | 1644 | 10000 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| FT232RQ | FTDI/飞特帝亚 | QFN-32 | 2000 | 2025-09-01 | ||||
| TLC2274AMDRG4 | TI/德州仪器 | SOP14 | 8127+ | 2500 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RG82855GME | ICC | BGA | 75 | 2025-09-01 | ||||
| MMIC321909T4097C6000 | TDK/东电化 | 6000 | 23+ | 60000 | 2025-09-01 | |||
| SB450 | ATI | 95 | 2025-09-01 | |||||
| AM82801UX | INTEL/英特尔 | BGA | 12 | 2025-09-01 | ||||
| NH82801HEM | INTEL/英特尔 | BGA | 50 | 2025-09-01 | ||||
| AC82GS45-SLB92 | INTEL/英特尔 | BGA | 210 | 2025-09-01 | ||||
| AC82PM45-SLB97 | INTEL/英特尔 | BGA | 179 | 2025-09-01 | ||||
| QG82945GM | INTEL/英特尔 | BGA | 151 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MMIC321909T4097C6000 | TDK/东电化 | 6000 | 23+ | 60000 | 2025-09-01 |
| 型号/型号规格 | 厂商 | 封装 | 批号 | 数量 | 更新日期 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| RG82855GME | ICC | BGA | 75 | 2025-09-01 |
